Precaution For Use
Cleaning
1.Special care shall be taken when applying the chemicals listed below for cleaning because certain chemicals may damage the surface of lens or case and cause discoloration.
Solvent
Adaptability
Ethyl alcohol, lsopropyl alcohol
O
Trichloroethylene, Chlorothene
Acetone, Thinner
X
 
2.Dipping time: 2 minutes max. at normal temperature.
 
Forming
1.The lead frame should be bent at a point 2 mm away from the body resin.
 
2.Bending should be performed with the base firmly fixed by means of a jig or radio pliers.
3.Lead forming should be performed prior to soldering.
4.Avoid applying any stress to resin in order to prevent the epoxy fracture and break on bonding wire.
5.Avoid Forming the lead Frame at the same point twice or more.
 
Soldering
1.Be sure not mount LEDs in conditions where excessive stress is applied to lead frames.
 
2.The mounting direction of the flat package type LED should be such that the direction of the LED electrodes is perpendicular to the direction of the board curve.
 
3.ETR will not guarantee LEDs mounted directly on the board because the resin bodies may be damaged by the applied force from board - warping, lead-cutting or clinching when being soldered. (It is strongly recommended that this should be carried out after very careful preparation.)
4.Care should be taken to avoid any shock or vibration to the LED resin body after it has been soldered until the temperature of the LED has returned to normal.
5.Conditions
 
Types
Soldering iron
Dip soldering
Reflow soldering
Temperature at tip of iron:
300 max.
(300 W max.)
soldering time: 3 sec. max.
Location: At least 3 mm
away from resin body
Pre-heating: 100 max.(Resin surface
temperature)
60 sec. max.
Bath temperature: 2605
(Small package: 2405)
Dipping time: 5 sec. max.
Location: At least 3.0mm away from resin body)

Not recommended

Temperature at tip of iron:
300 max.
(300 W max.)
soldering time: 3 sec. max.
Location: At least 2.6 mm
away from resin body
Pre-heating: 80 max.(Resin surfacetemperature)
60 sec. max.
Bath temperature: 2605
(Small package: 2405)
Dipping time: 5 sec. max.
Location: At least 3.0mm away from resin body)

Not recommended

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